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1

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - High performance IPDs (Integrated passive devices) and TGV (Through glass via) interposer technology using the photosensitive glass

Yook, Jong-Min, Kim, Dongsu, Kim, Jun Chul

Year:

2014

Language:

english

File:

PDF, 2.69 MB

english, 2014

2

[IEEE 2007 European Microwave Conference - Munich, Germany (2007.10.9-2007.10.12)] 2007 European Microwave Conference - An X-band high power amplifier module package using selectively anodized aluminum substrate

Sung-Ku Yeo,, Jong-Hoon Chun,, Kyoung-Min Kim,, Jong-Min Yook,, Young-Se Kwon,

Year:

2007

Language:

english

File:

PDF, 533 KB

english, 2007

3

High-Performance RF Inductors and Capacitors Using the Reverse Trench Structure of Silicon

Yook, Jong-Min, Kim, Dongsu, Kim, Jun Chul

Journal:

IEEE Microwave and Wireless Components Letters

Year:

2015

Language:

english

File:

PDF, 1.12 MB

english, 2015

4

Compact and low-profile GaN hybrid-IC based on TSV Si-interposer technology

Yook, Jong-Min, Kim, Dongsu, Kim, Junchul

Journal:

Microwave and Optical Technology Letters

Year:

2017

Language:

english

File:

PDF, 717 KB

english, 2017

5

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Double-sided Si-interposer with embedded thin film devices

Yook, Jong-Min, Kim, Dong-Su, Kim, Jun-Chul

Year:

2013

Language:

english

File:

PDF, 1006 KB

english, 2013

6

High- Q trenched spiral inductors and low-loss low pass filters using through silicon via processes

Yook, Jong-Min, Kim, Dongsu, Kim, Jun Chul

Journal:

Japanese Journal of Applied Physics

Year:

2014

Language:

english

File:

PDF, 497 KB

english, 2014

7

[IEEE 2017 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) - Pavia (2017.9.20-2017.9.22)] 2017 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) - Small and low-profile GaN hybrid-IC LNA using embedded-IC process in silicon

Yook, Jong-Min, Kim, Dongsu, Kim, Jun Chul

Year:

2017

Language:

english

File:

PDF, 1.43 MB

english, 2017

8

High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via

Kim, Joohee, Cho, Jonghyun, Kim, Joungho, Yook, Jong-Min, Kim, Jun Chul, Lee, Junho, Park, Kunwoo, Pak, Jun So

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 1.78 MB

english, 2014

9

[IEEE 2019 49th European Microwave Conference (EuMC) - Paris, France (2019.10.1-2019.10.3)] 2019 49th European Microwave Conference (EuMC) - A Compact 28 GHz RF Front-end Module using IPDs and Wafer-level Metal Fan-out Packaging

Yook, Jong-Min, Kim, Dongsu, Park, Bok-Ju, Sim, Sanghoon, Eo, Yun-Seong, Kim, Jun Chul

Year:

2019

File:

PDF, 790 KB

2019

10

Spiral Inductors Using Polymer-Core Conductors

Yook, Jong-Min, Kwon, Young-Se

Journal:

IEEE Microwave and Wireless Components Letters

Year:

2007

Language:

english

File:

PDF, 1.90 MB

english, 2007

11

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Embedded passive and active package using silicon substrate

Jong-Min Yook,, Jun-Chul Kim,, Dong-Su Kim,, Jong-Chul Park,

Year:

2011

Language:

english

File:

PDF, 1.42 MB

english, 2011

12

Thermally enhanced GaN hybrid-IC power amplifier using embedded IC process in a copper sheet

Yoon, Tae-Woong, Kim, Dong-Su, Yook, Jong-Min

Journal:

Microwave and Optical Technology Letters

Year:

2018

Language:

english

File:

PDF, 4.85 MB

english, 2018

13

[IEEE 2016 IEEE/MTT-S International Microwave Symposium (IMS) - San Francisco, CA (2016.5.22-2016.5.27)] 2016 IEEE MTT-S International Microwave Symposium (IMS) - Low-profile and chip-scale RF FEM using Si-interposer technology

Seong-Ryul Kim,, Chngkun Park,, Jong-min Yook,

Year:

2016

Language:

english

File:

PDF, 521 KB

english, 2016

14

Advanced RF CMOS power amplifier with a monolithic high-Q transformer on a thick laminated organic layer

Kim, Seong-Ryul, Park, Changkun, Yook, Jong-Min

Journal:

Microwave and Optical Technology Letters

Year:

2017

Language:

english

File:

PDF, 394 KB

english, 2017

15

[IEEE 2007 European Microwave Integrated Circuit Conference - Munich, Germany (2007.10.8-2007.10.10)] 2007 European Microwave Integrated Circuit Conference - An X-band high power amplifier module package using selectively anodized aluminum substrate

Sung-Ku Yeo,, Jong-Hoon Chun,, Kyoung-Min Kim,, Jong-Min Yook,, Young-Se Kwon,

Year:

2007

Language:

english

File:

PDF, 533 KB

english, 2007

16

Ultrawideband Signal Transition Using Quasi-Coaxial Through-Silicon-Via (TSV) for mm-Wave IC Packaging

Yook, Jong-Min, Kim, Young-Gon, Kim, Wansik, Kim, Sosu, Kim, Jun Chul

Journal:

IEEE Microwave and Wireless Components Letters

Year:

2020

Language:

english

File:

PDF, 2.06 MB

english, 2020

17

[IEEE 2007 European Microwave Conference - Munich, Germany (2007.10.9-2007.10.12)] 2007 European Microwave Conference - Embedded IC technology for compact packaging inside aluminum substrate (Pocket Embedded Packaging)

Kyoung-Min Kim,, Jong-Min Yook,, Sung-Ku Yeo,, Young-Se Kwon,

Year:

2007

Language:

english

File:

PDF, 289 KB

english, 2007

18

Silicon-core Coaxial Through Silicon Via for Low-loss RF Si-interposer

Lee, Won-Chul, Min, Byung-Wook, Kim, Jun Chul, Yook, Jong-Min

Journal:

IEEE Microwave and Wireless Components Letters

Year:

2017

Language:

english

File:

PDF, 896 KB

english, 2017

19

Suspended Spiral Inductor and Band-Pass Filter on Thick Anodized Aluminum Oxide

Jong-Min Yook,, Kyoung-Min Kim,, Young-Se Kwon,

Journal:

IEEE Microwave and Wireless Components Letters

Year:

2009

Language:

english

File:

PDF, 1.07 MB

english, 2009

20

Inhibitory effects of chlorophyllin on 7,12-dimethylbenz[a]anthracene-induced bacterial mutagenesis and mouse skin carcinogenesis

Won-Yoon Chung, Jong-Min Lee, Mi-Young Park, Jong-In Yook, Jin Kim, An-Sik Chung, Young-Joon Surh, Kwang-Kyun Park

Journal:

Year:

1999

Language:

english

File:

PDF, 120 KB

english, 1999

21

[IEEE 2007 European Microwave Integrated Circuit Conference - Munich, Germany (2007.10.8-2007.10.10)] 2007 European Microwave Integrated Circuit Conference - Embedded IC technology for compact packaging inside aluminum substrate (pocket embedded packaging)

Kyoung-Min Kim,, Jong-Min Yook,, Sung-Ku Yeo,, Young-Se Kwon,

Year:

2007

Language:

english

File:

PDF, 289 KB

english, 2007

22

High-quality solenoid inductor using dielectric film for multichip modules

Jong-Min Yook,, Ju-Hyun Ko,, Man-Lyun Ha,, Young-Se Kwon,

Journal:

IEEE Transactions on Microwave Theory and Techniques

Year:

2005

Language:

english

File:

PDF, 1.06 MB

english, 2005

23

[IEEE 2007 European Microwave Integrated Circuit Conference - Munich, Germany (2007.10.8-2007.10.10)] 2007 European Microwave Integrated Circuit Conference - RF transmission lines and spiral inductors using polymer-core conductor

Jong-Min Yook,, Kyoung-Min Kim,, Sung-Ku Yeo,, Je-In Yu,, Young-Se Kwon,

Year:

2007

Language:

english

File:

PDF, 518 KB

english, 2007

24

Air-Cavity Transmission Lines on Anodized Aluminum for High-Performance RF Modules

Jong-Min Yook,, Kyoung-Min Kim,, Young-Se Kwon,

Journal:

IEEE Microwave and Wireless Components Letters

Year:

2009

Language:

english

File:

PDF, 1.32 MB

english, 2009

25

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - High density and low-cost silicon interposer using thin-film and organic lamination processes

Yook, Jong-Min, Kim, Jun Chul, Park, Se-Hoon, Ryu, Jong-In, Park, Jong Chul

Year:

2012

Language:

english

File:

PDF, 1.37 MB

english, 2012

26

[IEEE 2007 European Microwave Conference - Munich, Germany (2007.10.9-2007.10.12)] 2007 European Microwave Conference - RF transmission lines and spiral inductors using polymer-core conductor

Jong-Min Yook,, Kyoung-Min,, Sung-Ku Yeo,, Je-In Yu,, Young-Se Kwon,

Year:

2007

Language:

english

File:

PDF, 518 KB

english, 2007

27

[IEEE 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2011.10.23-2011.10.26)] 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems - High-frequency through-silicon Via (TSV) failure analysis

Kim, Joohee, Cho, Jonghyun, Pak, Jun So, Kim, Joungho, Yook, Jong-Min, Kim, Jun Chul

Year:

2011

Language:

english

File:

PDF, 678 KB

english, 2011

28

30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via

Jung, Daniel H., Kim, Heegon, Kim, Sukjin, Kim, Jonghoon J., Bae, Bumhee, Kim, Jonghoon, Yook, Jong-Min, Kim, Jun-Chul, Kim, Joungho

Journal:

IEEE Microwave and Wireless Components Letters

Year:

2014

Language:

english

File:

PDF, 917 KB

english, 2014

29

Compact and low-loss wilkinson power divider using a high-Q spiral inductor on a sapphire substrate

Yoon, Tae-Woong, Kim, Dong-Su, Yook, Jong-Min

Journal:

Microwave and Optical Technology Letters

Year:

2018

Language:

english

File:

PDF, 655 KB

english, 2018

30

[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - Frequency and time domain measurement of through-silicon via (TSV) failure

Jung, Daniel H., Kim, Joohee, Kim, Heegon, Kim, Jonghoon J., Kim, Joungho, Pak, Jun So, Yook, Jong-Min, Kim, Jun Chul

Year:

2012

Language:

english

File:

PDF, 667 KB

english, 2012

31

[IEEE 2012 42nd European Microwave Conference (EuMC 2012) - Amsterdam (2012.10.29-2012.11.1)] 2012 42nd European Microwave Conference - Embedded IC module package using silicon substrate

Yook, Jong-Min, Kim, Jun Chul, Kim, Dongsu, Park, Jong-Chul

Year:

2012

Language:

english

File:

PDF, 2.02 MB

english, 2012

32

Compact mm-Wave Bandpass Filters Using Silicon Integrated Passive Device Technology

Kim, Dong-Min, Min, Byung-Wook, Yook, Jong-Min

Journal:

IEEE Microwave and Wireless Components Letters

Year:

2019

Language:

english

File:

PDF, 1.22 MB

english, 2019

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